An independent engineer checks your schematic, PCB layout and BOM before you commit to fabrication and assembly. Every finding is ranked by severity, explains its impact and cites the datasheet or standard behind it.
Four places electronic design risk hides — in the schematic logic, on the pads, across the stack-up, and throughout the 3D layout.
Pin connections, supply rail decoupling, pull-ups, and reverse protection verified before layout.
Component height clearances, connector access, high-current copper width, and differential pairs.
Library land patterns audited against actual manufacturer physical package dimensions.
Layer count, copper weights, reference ground planes, and microvia aspect ratios.
Every net, rail and part checked against its datasheet.
What the schematic can't show.
What gets bought matches what was designed.
Software AI models predict plausible-sounding words from text tokens. Electronic hardware obeys the laws of electromagnetics and physics. Here is why senior engineering review succeeds where automated AI copilots fail.
Trained on web text and generic forums. Prone to plausible hallucinations, misses critical silicon revisions, and cannot measure electromagnetic field behavior or assembly line tolerances.
Every design is analyzed by experienced hardware engineers with verified datasheet citations, real-world DFM fabrication rules, and rigorous net-by-net electrical validation.
Hallucinates alternate pin configurations; assumes default GPIO mappings and completely misses manufacturer silicon errata notes.
Audits pin assignments against official silicon errata sheets, verifying hardware bootstrap states, pull-up/down ratios, and analog pin isolations.
Performs naive nominal value checks (e.g. "10µF capacitor is present"), unaware that small ceramic MLCCs lose up to 70% capacitance under DC bias voltage.
Validates actual effective capacitance under applied DC bias, ESR stability requirements for switch-mode regulators, and capacitor ripple current ratings.
Treats schematic connections as abstract mathematical nets; blind to split ground planes, excessive loop inductance, and return-current crosstalk.
Analyzes copper stack-up geometry, high-frequency return current paths, reference plane continuity, and critical decoupling loop inductances.
Repeats baseline EDA DRC numbers without context; misses tombstoning risks, thermal relief starving, solder wicking into vias, and tight connector access.
Audits footprint pad geometry against component datasheets, verifying solder mask dams, thermal balance, pick-and-place clearances, and fab limits.
A Design Assurance Report with a readiness status and every finding ranked by severity.
Submit your design files securely under NDA. Receive your actionable Design Assurance Report before committing thousands to fab and assembly.